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Chelating efficiency and thermal, mechanical and decay resistance performances of chitosan copper complex in wood-polymer composites  ( SCI-EXPANDED收录 EI收录)   被引量:29

文献类型:期刊文献

英文题名:Chelating efficiency and thermal, mechanical and decay resistance performances of chitosan copper complex in wood-polymer composites

作者:Lu, John Z.[1] Duan, Xinfang[2] Wu, Qinglin[1] Lian, Kun[3]

第一作者:Lu, John Z.

通信作者:Lu, JZ[1]

机构:[1]Louisiana State Univ, Ctr Agr, Sch Renewable Nat Resources, Baton Rouge, LA 70803 USA;[2]Chinese Acad Forestry, Res Inst Wood Ind, Beijing 100091, Peoples R China;[3]Louisiana State Univ, Ctr Adv Microstruct & Devices, Baton Rouge, LA 70806 USA

年份:2008

卷号:99

期号:13

起止页码:5906-5914

外文期刊名:BIORESOURCE TECHNOLOGY

收录:;EI(收录号:20082011252729);Scopus(收录号:2-s2.0-43049155983);WOS:【SCI-EXPANDED(收录号:WOS:000256654600082)】;

基金:The financial support on this project by the National Science Foundation (Grant No. 0080248) is acknowledged. Any opinions, findings, and conclusions or recommendations expressed in this manuscript are those of the authors and do not necessarily reflect the view of the National Science Foundation. The authors wish to thank Dr. John P. Jones at the Department of Plant Pathology and Crop Physiology, Louisiana State University Agricultural Center for his helps on the decay resistance tests.

语种:英文

外文关键词:chelating; chemical modification; fungal decay resistance; mechanical and thermal properties; wood-polymer composites

摘要:Wood-polymer composites (WPC) have been extensively used for building products, outdoor decking, automotive, packaging materials, and other applications. WPC is subject to fungal and termite attacks due to wood components enveloped in the thermoplastic matrix. Much effort has been made to improve decay resistance of WPC using zinc borate and other chemicals. In this study, chitosan copper complex (CCC) compounds were used as a potential preservative for wood-HDPE composites. CCC was formulated by reacting chitosan with copper salts under controlled conditions. Inductively coupled plasma (ICP) analytical results indicated that chitosan had high chelating efficiency with copper cations. CCC-treated wood-HDPE composites had a thermal behavior similar to untreated and zinc borate-treated wood-HDPE composites. Incorporation of CCC in wood-HDPE composites did not significantly influence board density of the resultant composites, but had a negative effect on tensile strength at high CCC concentration. In comparison with solid wood and the untreated wood-HDPE composites, 3% CCC-treated wood-HDPE composites significantly improved the decay resistance against white rot fungus Trametes versicolor and brown rot fungus Gloeophyllum trabeum. Especially, CCC-treated wood-HDPE composites were more effectively against the brown rot than the untreated and chitosan-treated wood-HDPE composites. Moreover, CCC-treated wood-HDPE composites performed well as zinc borate-treated wood-HDPE composites on fungal decay resistance. Accordingly, CCC can be effectively used as a preservative for WPC. (C) 2007 Elsevier Ltd. All rights reserved.

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