文献类型：期刊文献

英文题名：Incorporation of microencapsulated dodecanol into wood flour/high-density polyethylene composite as a phase change material for thermal energy storage

作者：Guo, Xi[1] Cao, Jinzhen[1] Peng, Yao[1] Liu, Ru[2]

第一作者：Guo, Xi

通信作者：Cao, JZ[1]

机构：[1]Beijing Forestry Univ, MOE Key Lab Wooden Mat Sci & Applicat, Beijing 100083, Peoples R China;[2]Chinese Acad Forestry, Res Inst Wood Ind, Beijing 100091, Peoples R China

年份：2016

卷号：89

起止页码：1325-1334

外文期刊名：MATERIALS & DESIGN

收录：;EI(收录号：20154801612345);Scopus(收录号：2-s2.0-84947731990);WOS:【SCI-EXPANDED(收录号:WOS:000366225200151)】；

基金：The financial support by the Fundamental Research Funds for the Central Universities in China (TD2011-14) is gratefully acknowledged.

语种：英文

外文关键词：Microencapsulated phase change materials (MicroPCMs); Wood-plastic composites (WPCs); Latent heat thermal energy

摘要：Microencapsulated phase change materials (MicroPCMs) containing dodecanol were fabricated using in situ polymerization. Eight groups of wood flour/high-density polyethylene (WF/HDPE) composites with or without MicroPCMs were prepared. The synthesized MicroPCMs were characterized by scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FTIR), differential scanning calorimetry (DSC) and thermogravimetric (TG) analysis. Thermal and mechanical properties of the composites were investigated. The results showed that: (1) various MicroPCMs with different average diameters and core/shell ratios were prepared. The MicroPCMs were successfully incorporated into wood-plastic composites (WPCs) and there was little damage to MicroPCMs during processing; (2) both the melting-freezing temperatures (272,11.3 degrees C) and the thermal stability (started to decompose at 256.9 degrees C) of MicroPCMs in composites had the potential for application in latent heat thermal energy storage (LHTES); and (3) the addition of MicroPCMs adversely affected flexural and tensile properties of WPCs but favored impact strength and surface hardness. The mechanical deterioration was acceptable for applications where mechanical properties are less important. (C) 2015 Elsevier Ltd. All rights reserved.