文献类型：期刊文献

中文题名：高频介质加热在木材胶合中的应用

英文题名：The application of high-frequency heating technology in wood bonding process

作者：陈勇平[1] 王金林[1] 李春生[1] 王志同[1]

第一作者：陈勇平

机构：[1]中国林业科学研究院木材工业研究所

年份：2007

卷号：18

期号：5

起止页码：37-41

中文期刊名：木材加工机械

外文期刊名：Wood Processing Machinery

基金："十一五"国家支撑专题"家具地板材的功能修饰与仿真技术";引进国际先进林业科学技术创新项目专题"竹;木基重组装饰材料制造与示范。"

语种：中文

中文关键词：高频;加热;木材;胶合

外文关键词：high-frequency; heating; wood; bonding

分类号：TS653

摘要：从高频胶合的原理出发,介绍了高频胶合的特点及高频加热系统,分析了国内外高频胶合的研究现状,探讨高频胶合中存在的问题,最后提出了高频胶合今后的发展方向。
In this paper the basic principles and traits of high-frequency bonding and the relevant heating system were briefly described. Meanwhile, the application of high-frequency technology in wood bonding was reviewed, and the existing problems were also pointed out; finally, the development trend of high-frequency bonding was put forward.