文献类型：期刊文献

英文题名：Preparation of a kind of novel sustainable mycelium/cotton stalk composites and effects of pressing temperature on the properties

作者：Liu, Ru[1,2] Long, Ling[1,2] Sheng, Yan[3] Xu, Jianfeng[2] Qiu, Hongyun[1,2] Li, Xiaoyan[2] Wang, Yanxia[3] Wu, Huagui[2]

第一作者：刘如

通信作者：Long, L[1]

机构：[1]Chinese Acad Forestry, Res Inst Forestry New Technol, Beijing 100091, Peoples R China;[2]Chinese Acad Forestry, Res Inst Wood Ind, Beijing 100091, Peoples R China;[3]Dongying Aigelin Biotechnol Co Ltd, Dongying 257500, Shandong, Peoples R China

年份：2019

卷号：141

外文期刊名：INDUSTRIAL CROPS AND PRODUCTS

收录：;EI(收录号：20193607396993);Scopus(收录号：2-s2.0-85071602369);WOS:【SCI-EXPANDED(收录号:WOS:000496611800068)】；

基金：This study was financially supported by the National Key Research and Development Program of China (No. 2016YFD06OO7O4).

语种：英文

外文关键词：Mycelium; Cotton stalk; Composite; Pressing temperature

摘要：A novel sustainable mycelium/cotton stalk composite was prepared in laboratory by growing cotton stalk with white rot fungus of Ganoderma lucidum in a block mold followed by hot-pressing process. The effects of pressing temperature (160, 180, and 200 degrees C) on physical, mechanical, and thermal properties of the composites were investigated. The results showed that with increasing pressing temperature, most properties of the composites increased significantly owing to the improved interfacial bonding at high temperature. However, it showed slight negative effect to the thermal decomposition resistance, while with increasing hot-pressing temperature, the thermal decomposition resistance of the composites was improved. After cultivation of mycelium, the structure of the cotton stalk particles was destroyed and main components, such as hemicelluloses and lignin degraded. However, after hot-pressing, the structures of the composites became compact and new chemical bonds between mycelium and cotton stalk particles occurred. The optimal group of this study was achieved under 200 degrees C hot-pressing, where the flexural and internal bonding strength was comparable to non-load bearing fibreboard.