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Revolutionizing flexible Electronics: Integrating liquid metal DIW 3D printing by bimolecular interpenetrating network  ( SCI-EXPANDED收录 EI收录)   被引量:7

文献类型:期刊文献

英文题名:Revolutionizing flexible Electronics: Integrating liquid metal DIW 3D printing by bimolecular interpenetrating network

作者:Chen, Yuan[1] Lu, Yun[1] Fan, Dongbin[1] Li, Jun[2] Kim, Chan Kyung[3] Guo, Dengkang[4] Li, Gaiyun[1]

第一作者:陈媛

通信作者:Lu, Y[1];Guo, DK[2]

机构:[1]Chinese Acad Forestry, Res Inst Wood Ind, 1 Dongxiaofu Xiangshan Rd, Beijing 100091, Peoples R China;[2]North Univ China, Sch Chem & Chem Engn, Taiyuan 030051, Peoples R China;[3]Inha Univ, Dept Chem & Chem Engn, 100 Inha Ro, Inchon 22212, South Korea;[4]China Natl Bamboo Res Ctr, Engn Technol Res Ctr Bldg & Decorating Mat Bamboo, Key Lab High Efficient Proc Bamboo Zhejiang Prov, Hangzhou 310012, Peoples R China

年份:2024

卷号:488

外文期刊名:CHEMICAL ENGINEERING JOURNAL

收录:;EI(收录号:20241515900048);Scopus(收录号:2-s2.0-85189861649);WOS:【SCI-EXPANDED(收录号:WOS:001238200900001)】;

基金:We sincerely thank the Fundamental Research Funds for the Central Non-profit Research Institution of CAF (Grant No.CAFYBB2022XD004) and the National Natural Science Foundation of China (Grant No. 32122058) .

语种:英文

外文关键词:Liquid metals; Cellulose nanofibrils; 3D printing; Super -flexibility; Electronics

摘要:Ultra -flexible liquid metal (LM) composites have significant potential in various applications, including soft robotics, wearable electronics, and human - machine interactions. This burgeoning field necessitates mass production at a critical scale alongside highly accurate and fully automated technology. In this study, a direct inkwriting (DIW) 3D all -printing strategy was developed, integrating cellulose nanofibrils (CNF), water -based polyurethane (WPU), and LM to fabricate high-performance LM -based electronic films, circuits, and diverse 2D or 3D structures. The stable ternary interface system was investigated, and bimolecular interpenetrating network system of CNF/WPU significantly enhanced the flexibility, reducing LM damage, mitigation, and leakage. Moreover, the systematic control of the DIW all -printing process facilitated high -resolution and excellent printability. The super -flexibility and precise electrical conductivity were demonstrated by investigating bending deformation and recyclable electrical signals. Electronics based on ultra -flexible LM, with a high LM content (78.0%), exhibited an accurate electrical response to bending deformation, extraordinary flexibility, and recyclable durability (up to 500 cycles). Notably, the all -printed system facilitates the complete automation, complex structuring, and precise moulding of various appliances. DIW 3D all -printing of LM has the potential to create complex conductive architectures for programmable and multi -material LM -based electronics, meeting high -precision, large-scale, and automated production requirements.

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