详细信息
文献类型:期刊文献
中文题名:无机质复合木材的复合工艺与性能
英文题名:TECHNIQUES AND PROPERTIES OF THE WOOD-INORGANIC COMPOSITE
作者:陈志林[1] 王群[1] 左铁镛[1] 傅峰[2] 王金林[2] 叶克林[2]
第一作者:陈志林
机构:[1]北京工业大学材料科学与工程学院;[2]中国林业科学研究院木材工业研究所
年份:2003
卷号:20
期号:4
起止页码:128-132
中文期刊名:复合材料学报
外文期刊名:Acta Materiae Compositae Sinica
收录:CSTPCD;;Scopus;北大核心:【北大核心2000】;CSCD:【CSCD2011_2012】;
基金:国家"十五"高技术研究发展计划(863)"木材/无机非金属复合材料制造技术"(2002AA245161);国家林业局林业科学技术研究课题(97-24)
语种:中文
中文关键词:无机质复合木材;浸渍;性能
外文关键词:wood-inorganic composite; impregnation; properties
分类号:TB332
摘要: 以我国丰富的速生人工林杨树木材为原料,以含硅、铝、硼、磷元素的离子化合物为浸渍溶液,采用双离子扩散的方法,通过浸渍木材后,使离子在木材孔隙内或细胞壁上发生沉淀反应,所得到的复合材料称为无机质复合木材。由于生成了不溶于水的沉淀物填充在木材的孔隙内,所以改善了木材的热分解特性和强度性能。研究表明,采用负压-正压试验处理设备强制将浸渍溶液灌注入木材内比室温常压浸渍的效果好,增重率能够提高3~5倍;用电子显微镜观察处理木材,无机质物质填充了木材的导管、木纤维和纹孔;热重分析表明,处理材热分解的峰顶点在420℃,到550℃失重率为32%。在研究范围内,处理材的强度与其增重率呈现正相关关系。
A kind of composite called wood-inorganic composite was produced by the method of double ions diffusion with fast growing Poplar wood, which is abundant in China, as the raw material and the ionic compound of silico n, alumi num, boron and phosphorous ions as the dipping solution. There were deposit reac tions between the various kinds of ions in the walls and vessels of wood's ce lls. The wood's performance of decomposition in high temperature and strength we re improved owing to water-fast deposits filling in holes of the wood. The results show that the performance of the wood is much more improved with the method of impregnating the solution into the wood by force by a self-made plus-minus pressure system compared to the method of impregnating the solution into the wood at normal press and temperature, and its WPG increas es by 3~5 times. The SEM micrographs show that inorganic substance is filled no t only in the vessels, fibers but also in the pits of the wood. The DTA Curve shows that the highest decomposition temperature of the treated wood is 420℃ and its loss percent of weight is 32 % at 550℃.In the research area,the streng th of the treated wood is in positive proportion with the weight percent gain of the composites.
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