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Effect of PF resin penetration on interphase microstructure and quantitative micromechanical properties of different grained-wood laminates  ( SCI-EXPANDED收录 EI收录)   被引量:7

文献类型:期刊文献

英文题名:Effect of PF resin penetration on interphase microstructure and quantitative micromechanical properties of different grained-wood laminates

作者:Li, Zhenrui[1] Long, Keying[1] Zhang, Yu[1] Chen, Kaiqiang[1] Lin, Lanying[1]

通信作者:Lin, LY[1]

机构:[1]Chinese Acad Forestry, Res Inst Wood Ind, Beijing 100091, Peoples R China

年份:2022

卷号:76

期号:6

起止页码:556-566

外文期刊名:HOLZFORSCHUNG

收录:;EI(收录号:20221211815092);Scopus(收录号:2-s2.0-85126546289);WOS:【SCI-EXPANDED(收录号:WOS:000766305300001)】;

基金:This study was supported by the National Natural Science Foundation of China (Grant no. 31890772).

语种:英文

外文关键词:adhesive penetration; grain directions; interphase microstructure; latewood bonding interphase; micromechanical properties

摘要:Wood, a natural anisotropic material, behaves differently in the radial (R) and tangential direction (T), which also gives rise to different penetration capacity of adhesive into wood tissues. The present study investigates the penetration behavior of adhesive in the interphase of three different wood laminates, namely R-R, T-R, and T-T combinations, and its effect on microstructure and micromechanical properties of the latewood bonding interphase using confocal laser scanning microscopy (CLSM) and nanoindentation (NI). The results showed that the average penetration depth (AP) of the radial surface (S-R) was higher than that of the tangential surface (S-T) and a significant improvement in the mechanics of cells compared with the control cell (C). the maximum reduced elastic modulus (E- r ) and hardness (H) found at the fourth cell row were 21.7 GPa and 0.62 GPa for R-R laminate, respectively, which increased by 43% and 29% compared with C (15.1 GPa, 0.48 GPa), and the maximum E- r and H found at the first cell row were 23.2 GPa and 0.65 GPa for T-T laminate, respectively, which increased by 52% and 44% compared with C (15.3 GPa, 0.45 GPa). The results provide an important platform for better understanding and predicting the properties of wood glue line and bonding interphase.

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