文献类型：期刊文献

英文题名：EFFECT OF EXPANDED POLYSTYRENE CONTENT AND PRESS TEMPERATURE ON THE PROPERTIES OF LOW-DENSITY WOOD PARTICLEBOARD

作者：Luo, Shupin[1,2] Gao, Li[1,2] Guo, Wenjing[1,2]

第一作者：罗书品

通信作者：Gao, L[1];Gao, L[2]

机构：[1]Chinese Acad Forestry, Res Inst Forestry New Technol, 1 Dongxiaofu, Beijing, Peoples R China;[2]Chinese Acad Forestry, Res Inst Wood Ind, 1 Dongxiaofu, Beijing, Peoples R China

年份：2020

卷号：22

期号：4

起止页码：549-558

外文期刊名：MADERAS-CIENCIA Y TECNOLOGIA

收录：;Scopus(收录号：2-s2.0-85091716300);WOS:【SCI-EXPANDED(收录号:WOS:000580588900013)】；

基金：This research was funded by the National Key Research and Development Program of China "Manufacturing technology of lightweight wood-based material" (grant number 2018YFD0600301) and the Special Fund of Chinese Academy of Forestry for Fundamental Scientific Research (grant number CAFYBB2017ZX003-3).

语种：英文

外文关键词：Density profile; expanded polystyrene (EPS); low-density particleboard; mechanical properties; microstructure; press temperature

摘要：In this study, three-layer low-density (about 400 kg/m(3)) particleboards consisting of a mixture of wood particles and expanded polystyrene (EPS) were manufactured. EPS bead was incorporated in the core layer as a light filler. The influence of EPS content (0 %, 2,5 %, 5 %, 7,5 %. 10 degrees A and 12,5 %) and press temperature (110 degrees C and 140 degrees C) on the microstructure, density profile, bending properties, internal bond and thickness swelling of the panels were investigated. Results showed that incorporation of EPS beads filled in the voids between wood particles improved the core layer integrity, and generated a more pronounced density profile. Consequently, the bending properties and internal bond of panels adding EPS were remarkably improved, and the thickness swelling was decreased. However, the variation of the number of EPS from 2,5 % to 12,5 % had no significant effect on the bending properties and thickness swelling. Comparing the two press temperatures, higher temperature (140 degrees C) was more favourable in control panels without EPS as filler. For panels adding EPS filler, 140 degrees C had a negative effect on the properties of panels, especially at high EPS contents (10% and 12,5%), attributing to the shrinkage of EPS bead under press temperature that is much higher than its glass transition temperature (104 degrees C).