文献类型：期刊文献

英文题名：Preparation of Hydrophobic Low-k Epoxy Resins with High Adhesion Using a Benzocyclobutene-Rosin Modifier

作者：Fu, Fei[1,2] Zhou, Xuan[1] Shen, Minggui[1] Wang, Dan[1] Xu, Xu[2] Shang, Shibin[1] Song, Zhanqian[1] Song, Jie[3]

第一作者：Fu, Fei

通信作者：Shen, MG[1]

机构：[1]Chinese Acad Forestry, Inst Chem Ind Forest Prod, Key Lab Biomass Energy & Mat, Natl Engn Lab Biomass Chem Utilizat,Key & Open Lab, Nanjing 210042, Jiangsu, Peoples R China;[2]Nanjing Forestry Univ, Coll Chem Engn, Jiangsu Coinnovat Ctr Efficient Proc & Utilizat Fo, Nanjing 210037, Peoples R China;[3]Univ Michigan Flint, Dept Chem & Biochem, Flint, MI 48502 USA

年份：2023

卷号：11

期号：15

起止页码：5973-5985

外文期刊名：ACS SUSTAINABLE CHEMISTRY & ENGINEERING

收录：;EI(收录号：20231513884779);Scopus(收录号：2-s2.0-85152207037);WOS:【SCI-EXPANDED(收录号:WOS:000967602400001)】；

基金：ACKNOWLEDGMENTS This work was supported by the National Natural Science Foundation of China (32271816) and Key R&D Projects of Guangxi Zhuang Autonomous Region (no. AB20238008) .

语种：英文

外文关键词：rosin; dielectric constant; recross-linking network; polarizability; printed circuit board

摘要：With the development of high-frequency communi-cation, the miniaturization of integrated circuits (ICs) has led to interconnected signal delays and losses. The dielectric properties of epoxy resins are no longer satisfactory, because of the presence of polar groups. Herein, a benzocyclobutene-rosin modifier was designed and synthesized to reduce the dielectric constant of epoxy resins. The recross-linking network of benzocyclobutene inhibits the polarizability of the polar groups, and rosin skeletons increase the free volume of epoxy resins. Consequently, the dielectric constant of epoxy resins decreased from 3.12 to 2.72 and their water absorption decreased from 1.06% to 0.861%. The dielectric constant and water absorption are lower than those of most commercial dielectric materials. Additionally, the adhesion of epoxy resins was improved, which broke the contradiction between the dielectric properties and the adhesion of traditional epoxy resins. The modified epoxy resin was finally applied to printed circuit boards. At 15 GHz, its signal loss was 28.8 dB, which was lower than that of a commercial epoxy resin (FR-4), demonstrating that the modified epoxy resin can better meet the miniaturization needs of ICs.