文献类型：期刊文献

英文题名：Flexural property of wood in low temperature environment

作者：Zhao, Liyuan[1] Jiang, Jinghui[1] Lu, Jianxiong[1] Zhan, Tianyi[1]

第一作者：Zhao, Liyuan

通信作者：Lu, JX[1]

机构：[1]Chinese Acad Forestry, Res Inst Wood Ind, State Key Lab Tree Genet & Breeding, Beijing 100091, Peoples R China

年份：2015

卷号：116

起止页码：65-69

外文期刊名：COLD REGIONS SCIENCE AND TECHNOLOGY

收录：;EI(收录号：20151900821638);Scopus(收录号：2-s2.0-84928803236);WOS:【SCI-EXPANDED(收录号:WOS:000356122800008)】；

基金：This work was financially supported by a project of the Research Institute for New Forestry Technology of Chinese Academy of Forestry (CAFINT2013C09).

语种：英文

外文关键词：Modulus of rupture; Modulus of elasticity; Low temperature; Cyro-SEM; Ductility

摘要：The effect of low temperatures (<0 degrees C) on the mechanical properties of wood materials was investigated in this study. The modulus of rupture (MOR) and modulus of elasticity (MOE) of birch (Betula platyphylla) with five different levels of moisture content (MC) (water-saturated, green, fiber-saturated, air-dried and oven-dried), were analyzed for temperature from 0 degrees C to - 196 degrees C. The morphological characteristics at low temperatures were explored by means of the cryogenic scanning electron microscopy (Cryo-SEM). The results showed that when the temperature was below 0 degrees C, MOR and MOE of specimens increased with decreasing temperature. Significant differences (p < 0.05) in MOR and MOE of the specimens at four out of five MC levels (water-saturated, green, fiber-saturated, and air-dried) were observed between +20 degrees C and - 196 degrees C. However, the effects of low temperatures on MOR and MOE of the oven-dried wood specimens were not significant. The higher the MC, the greater and faster was the increase in MOR and MOE. The ductility ratio decreased with decreasing temperature for all MC levels, which means increasing flexibility below 0 degrees C. The findings suggest that extremely low temperatures have an important influence on the performance of wood with various MC. (C) 2015 Elsevier B.V. All rights reserved.