文献类型：期刊文献

英文题名：Strategies for developing low dielectric epoxy materials

作者：Fu, Fei[1] Xu, Yuandong[1] Shen, Minggui[3] Xu, Xu[2] Liu, He[1,3]

第一作者：Fu, Fei

通信作者：Xu, YD[1];Liu, H[1];Shen, MG[2];Liu, H[2]

机构：[1]Henan Univ Technol, Inst Biomass Sci & Engn, Zhengzhou 450001, Peoples R China;[2]Nanjing Forestry Univ, Coll Chem Engn, Nanjing 210037, Peoples R China;[3]Chinese Acad Forestry, Inst Chem Ind Forest Prod, Nanjing 210042, Peoples R China

年份：2025

卷号：240

外文期刊名：EUROPEAN POLYMER JOURNAL

收录：;EI(收录号：20254319395755);Scopus(收录号：2-s2.0-105019713606);WOS:【SCI-EXPANDED(收录号:WOS:001607935900001)】；

基金：This work was supported by the National Natural Science Foundation of China (32401521), Henan Provincial Science and Technology Tackling Project (252102230154), and Henan University of Technology Doctoral Fund Project (2023BS090) .

语种：英文

外文关键词：Epoxy resin; Low dielectric material; Dielectric constant; Free volume; Polarization; Porous structure

摘要：Epoxy resins are vital dielectric materials for integrated circuits owing to their excellent insulation, mechanical strength, thermal stability, and cost efficiency. However, conventional epoxy resins generate polar hydroxyl groups and ester/imine bonds during curing, resulting in high dielectric constants and losses that limit their applicability in 5G and high-frequency devices. This review highlights two key strategies for achieving lowdielectric epoxy resins: (1) polarity reduction through fluorine/siloxane incorporation and non-polar molecular design, and (2) density modulation via bulky substituents, hyperbranched architectures, and nanoporous structures. It elucidates the primary dielectric determinants (dipole strength and dipole density), while systematically comparing the advantages and limitations of various modification methods. Furthermore, the review examines the trade-offs between dielectric optimization and mechanical/thermal performance, providing a comprehensive design framework for next-generation epoxy dielectrics (k < 3.0) that harmonize electrical efficiency with structural integrity, thereby offering practical guidance for advanced electronic packaging applications.