文献类型：会议论文

英文题名：Preparation of degradable and recyclable conductive adhesive for epoxy group packaging

作者：Yang, Wenxin[1] Fu, Renli[1] Huang, Jinrui[2]

第一作者：Yang, Wenxin

机构：[1] School of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Jiangsu, Nanjing, 210000, China; [2] National Engineering Laboratory for Biomass Chemical Utilization, Institute of Chemical Industry of Forest Products, Chinese Academy of Forestry, Jiangsu, Nanjing, 210000, China

会议日期：November 8, 2024 - November 10, 2024

会议地点：Guangzhou, China

语种：英文

外文关键词：Adhesives - Chip scale packages - Conductive materials - Epoxy composites - Packaging materials - Sustainable development

年份：2025

摘要：In this study, we developed a degradable and recyclable conductive adhesive system using polyetheramine D400 and imidazole formaldehyde. This novel epoxy resin matrix incorporates a dynamic imine bond, enhancing the degradation and scalability issues associated with traditional epoxy thermosetting resins commonly used in composites and smart devices. We enhanced this matrix by integrating conductive fillers. Our findings reveal that the adhesive exhibits high shear strength (14 MPa) and low volume resistivity (8.64*10-5 Ω*cm). The pH-sensitive imine bonds enable the adhesive to degrade rapidly under mild conditions, allowing for the efficient recovery of valuable conductive particles. This approach provides a flexible platform for advancing the functionality and intelligence of traditional thermosetting materials. 2025 Published under licence by IOP Publishing Ltd.