文献类型：期刊文献

英文题名：Applications of Electrically Conductive Epoxy Adhesives

作者：Chen, Jie[1] Li, Wenbin[1] Nie, Xiaoan[1]

第一作者：陈洁

机构：[1] Institute of Chemical Industry of Forest Products, Jiangsu Province, Chinese Academy of Forestry, 16 Suojin Wucun, Nanjing, 210042, China

年份：2023

起止页码：415-434

外文期刊名：Engineering Materials

收录：EI(收录号：20230213365441)

语种：英文

外文关键词：Additives - Adhesives - Conductive materials - Fillers - Microelectronics - Wire

摘要：Electrically conductive adhesives (ECAs) mainly comprise the resin matrix, conductive particles, dispersion additives, and other additives. ECAs can effectively bond various materials and have conductive properties. The conductive mechanism of ECAs is considered to be the contact between conductive particles to form an electrical path. ECAs are widely used for microelectronic assembly, including the connection of thin wires with printed circuits, electroplating bottom plates, metal layers of ceramic adhere and metal chassis, bonding wire and tube base, bonding elements, and plane hole passing through printed circuits, bonding waveguide tuning, and hole repair. At present, much research has been done in epoxy-based conductive adhesives, including categories, conduction mechanisms, fillers, and applications. ? 2023, The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.