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Eco-Friendly Phenol-Urea-Formaldehyde Co-condensed Resin Adhesives Accelerated by Resorcinol for Plywood Manufacturing  ( SCI-EXPANDED收录)   被引量:29

文献类型:期刊文献

英文题名:Eco-Friendly Phenol-Urea-Formaldehyde Co-condensed Resin Adhesives Accelerated by Resorcinol for Plywood Manufacturing

作者:Pang, Bo[1] Li, Ming-Kan[1] Yang, Sheng[2] Yuan, Tong-Qi[1] Du, Guan-Ben[3] Sun, Run-Cang[1]

第一作者:Pang, Bo

通信作者:Yuan, TQ[1];Sun, RC[1]

机构:[1]Beijing Forestry Univ, Beijing Key Lab Lignocellulos Chem, 35 Tsinghua East Rd, Beijing 100083, Peoples R China;[2]Chinese Acad Forestry, Res Inst Wood Ind, 1 Dong Xiao Fu,Xiang Shan Rd, Beijing 100091, Peoples R China;[3]Southwest Forestry Univ, Yunnan Key Lab Wood Adhes & Glued Prod, 300 Bailong Temple, Kunming 650224, Yunnan, Peoples R China

年份:2018

卷号:3

期号:8

起止页码:8521-8528

外文期刊名:ACS OMEGA

收录:;Scopus(收录号:2-s2.0-85051065385);WOS:【SCI-EXPANDED(收录号:WOS:000440617900009)】;

基金:We acknowledge the financial support of this research from the National Key R&D Program of China (2017YFB0307903) and the National Natural Science Foundation of China (31670587).

语种:英文

摘要:Eco-friendly and good-performance resin adhesives are needed for wood manufacturing. In this study, phenol-urea-formaldehyde (PUF) resin adhesives were modified by adding various ratios of resorcinol. The properties of PUF, phenol-resorcinol-urea-formaldehyde (PRUF) resin adhesives, and the performances of the prepared plywood were tested. The curing behaviors and the structural features of the PUF and PRUF resin adhesives were investigated via dynamic scanning calorimetry, thermal gravimetric analysis, C-13 NMR, and cross polarization magic angle spinning C-13 NMR. The results indicated that 1.3% resorcinol (based on resin, w/w) could decrease the curing temperature and accelerate the curing process after PUF resin modification. The PRUF resin adhesives demonstrated a lower activation energy during the curing process, with up to 28.8% less energy than that of PUF resin adhesive without any curing agent. The plywood demonstrated low formaldehyde emissions (< 0.1 mg L-1) and acceptably high bonding strengths (> 1.00 MPa). This work provided a method for preparing an easy-cured and high-performance phenolic resin for wood manufacturing.

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